亚洲国产成人精品无码区二本在线_欧美日韩一线二线aⅴ_最新精品视频2019在线视频_а√天堂在线观看免费_亚洲av一级毛片_亚洲日韩欧美综合中文字幕_凝凝长大了可以吃了_护士的小嫩嫩好紧好爽_厕所露脸高清近距离偷拍_国产精品福利自在线观看

There are many kinds of circuit boards, but most of them can be divided into two types: hard board and soft board. Today we will talk about the structure of soft board. They can be divided into single-layer boards, double-panel boards and multi-layer boards, and their structures are also different. Now let's introduce their different properties. Let's have a look.

Introduction to the structure level of soft board

1. Structure of single-layer board

This is the flexible plate with the simplest structure, and usually uses the base material to protect the transparent rubber copper foil; First of all, the copper foil needs to be etched to obtain the required circuit, and the protective film needs to be drilled to expose the corresponding solder pad. After cleaning, the two are combined by rolling method, and then the exposed solder pad is electroplated with gold or tin for protection, and then it needs to be punched into a small circuit board of corresponding shape.

2. Structure of double-sided board

Its raw material is copper foil protective film transparent adhesive. First, drill holes in the protective film according to the requirements of the pad location, then stick the copper foil, and then stick another protective film with drilled holes after etching the pad and lead.

3. Structure of multilayer board

The most typical difference between multilayer board and single-layer board is that the through hole structure is added to connect each layer of copper foil. Generally, the first processing process of transparent adhesive copper foil is to make through holes; First, drill holes on the base material and copper foil, then wash them, and then coat them with a certain thickness of copper, so that the through-hole is finished, and the subsequent manufacturing process is almost the same as that of the single-layer board.

Although the types and structures of FPC soft board are different, many manufacturing processes have the same features, but different processes are added in some basic places to correspond to different fields.